TSMC Chairman C.C. Wei announced in early March in the US that the company would increase its investment by US$100 billion, ...

TSMC is taking the wafer-scale fabrication battle ... it introduced its next-generation system-on-wafer platform—CoW-SoW—that will enable 3D integration with wafer-scale designs.

Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal ...

The workflow was developed for TSMC’s InFO packaging technology, an integration method which delivers high-density interconnection and performance in silicon in 2D or 3D arrangements. Siemens employed ...

This will build on the $65 billion that TSMC already has staked here, the largest direct investment ever by a foreign corporation in the country. Here's a closer look at what the announcement ...

As part of the Trump administration’s Made in America push, TSMC could acquire a stake in Intel. According to a report from Taiwan’s Economic Daily publication, TSMC is looking to acquire a 20 ...

It makes integrated circuits for customers based on their proprietary IC designs. TSMC has long benefited from semiconductor firms around the globe transitioning from integrated device ...

TL;DR: TSMC's CEO, Dr. C.C. Wei, confirmed no plans to acquire Intel's US semiconductor facilities, despite ongoing rumors. TSMC chairman and CEO Dr. C.C. Wei ruled out acquiring Intel's ...