But not so fast — it looks like the machines needed to make the chips are the latest victims of the shortage. According to Nikkei Asia, wire bonding machines, wafer dicers, and laser drilling ...

Before the advent of flip chips and solder ball techniques, wire bonding was the traditional interconnection method to and from the chip. See flip chip and chip package. THIS DEFINITION IS FOR ...

The basic story being that, for various reasons , there is no cheaper way to get a chip on a board than to ... “semi-automatic thermosonic wire bonding machine,” and slotted into a fixture ...

KEYS unveils a solder-free solution for precise Wide-Bandgap chip testing, reducing parasitics and enabling faster, more accurate characterization.

Keysight Technologies, Inc. (NYSE: KEYS) has enhanced its double-pulse test portfolio enabling customers to benefit from ...