The A20 chip widely expected to debut in the iPhone 18 Pro and folding iPhone will take advantage of a new packaging ...

Apple is planning to overhaul its chip design for the 2026 iPhones, marking the first time it uses advanced multi-chip packaging.

packaging to WMCM (Wafer-Level Multi-Chip Module) packaging, while memory will be upgraded to 12GB. In terms of the differences in packaging method, InFo allows integration of components ...

The 20th-anniversary iPhone stands to offer a major jump forward in on-device processing, with memory changes potentially ...

CUDIMM stands for Clocked Unbuffered Dual in-line Memory Module. With high quality DDR5 ... while the external packaging uses FSC certified paper, ensuring it is sourced from responsibly managed ...

Currently in the works by JEDEC's JC-45 committee, MRDIMM is a new module ... packaging. For mobile applications, JEDEC is working in parallel on an updated module design for the LPDDR6 memory ...

The box packaging reveals several key components, including the logo typeface and the memory specifications ... the RTX 5080 ...

SMART Modular Technologies brought something different to the table. While a lot of booths were about RGB and new silicon, ...