Like its predecessor, the Primo AD-RIE delivers a capital productivity gain of 35 to 50 percent when compared to the industry standard. Overall cost of ownership is reduced by 20 to 40 percent. A ...

Accurately characterizing high aspect ratio geometries—such as narrow gaps, deep trenches, and deep holes—is becoming increasingly important across a wide range of technologies and industries. To meet ...

The Phantom III RIE is designed to supply research and failure analysis laboratories with state-of-the-art plasma etch capability using single wafers, dies or parts using fluorine and oxygen based ...

Etching is a way of removing a material through either chemical or physical means. There are many ways etching of the surface a material can be performed, but in the world of nanoscale etching, ...

The demand for accurate characterization of high aspect ratio geometries such as narrow gaps, deep trenches or deep holes arises in many technologies and industries. A variety of metrology techniques ...

The rapid migration to mobile electronics, and the growing richness of applications like data streaming and social media, is raising new performance imperatives for memory capacity and speed. The ...

Plasma chemistry and etching processes form the backbone of modern semiconductor fabrication, enabling the precise patterning and removal of material layers essential to device performance. By ...

Both capacitively (RIE) and inductively (ICP) coupled plasma etcher with fluorine-based gases (CF4, CHF3, C4F8, SF6), BCl3, nitrogen, argon, and oxygen for anisotropic dry etching of Si-based ...

Mass spectrometry, by contrast, is a powerful technique for the analysis of any process gas. Careful consideration of differences in pressure, reaction time scales and process flow is essential for ...